Incoming Material Visual Test

Check the chip model, quantity, year, origin, whether it has been recoated, pin status, whether there are signs of regrinding, unknown residues, location of the manufacturer's logo, etc.

X-Ray Test

Check the chip's lead frame, wafer size, gold wire bonding pattern, ESD damage, holes, etc. Customers can provide good products for comparative inspection.

Function Test

Main function test. It refers to various necessary electrical performance, logic or signal status tests under specific working conditions (i.e. the normal use environment of the equipment, usually room temperature) and when the equipment is in normal working state.

Soderability Test

Check whether the solderability of the chip pins meets the standards and whether they can be successfully soldered to the end customer's machine.

RoHS test

The product is divided into a single material and uniform material and then tested. Among them, lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) and other six hazardous substances meet the requirements of the RoHS directive, the highest Restriction standards: cadmium: 0.01% (100PPM);

Packaging and Shipment

The final step of the testing service is packaging and shipping. We attach great importance to this link as much as other testing items. We recognize the importance of returning components to customers in a timely and safe manner and provide complete packaging and transportation services. , To assist you in transporting the goods to your designated destination.